README.md
# MSP-EXP430FR5994 LaunchPad - tscircuit edition
A four-layer tscircuit recreation of TI's MSP-EXP430FR5994 LaunchPad development kit. Its seven schematic sheets follow the organization of TI user guide SLAU678C: system overview, MSP430FR5994 target, 40-pin BoosterPack and user interface, microSD and supercapacitor, target supply, eZ-FET host, and protected USB power.
## Implemented hardware
- Exact MSP430FR5994IPNR 80-pin target MCU (JLCPCB C2052740), including all supply pins, reset, 32.768 kHz crystal, and 4 MHz resonator.
- Four 10-pin headers forming TI's 40-pin BoosterPack interface, with reference signal mappings.
- Two user pushbuttons, two user LEDs, reset button, external 3.3 V and 5 V headers, and mounting hardware.
- MSP430F5528-based eZ-FET debugger, protected Micro-USB interface, backchannel UART, programming links, status LEDs, and target-power selection.
- 0.22 F supercapacitor with a current-limited charge path and three-position USE/CAP/CHARGE selector.
- Bottom-side microSD footprint and SPI connections. It is intentionally marked DNP because TI removed the end-of-life socket from currently manufactured boards.
## Power and jumper defaults
- Fit J_ISO_TST, J_ISO_RST, J_ISO_RX, J_ISO_TX, J_ISO_VCC, and J_ISO_GND for normal USB-powered programming and backchannel UART.
- Fit J_CURRENT for normal operation. Remove it only to insert a current meter between TARGET_3V3 and TARGET_VCC.
- Fit the J_PWRSEL shunt on pins 1-2 for debugger-powered operation, or pins 2-3 for a regulated external target supply. Never join both sources.
- On J_CAP_MODE, fit pins 2-3 to charge the supercapacitor through 22 ohms. Move the shunt to pins 1-2 to power the target from the charged capacitor. Never bridge all three pins.
- Leave J_SD unpopulated unless a mechanically compatible Molex 502702-0831 socket is sourced and its fit is verified.
## Intentional reference deviation
TI's patented, software-controlled EnergyTrace DCDC circuit is replaced by a conventional TLV70033 3.3 V regulator and removable power links. Programming, UART, BoosterPack I/O, external power, current measurement, microSD connections, and supercapacitor operation remain usable; EnergyTrace profiling is not implemented.
## Manufacturing status
- Default tscircuit autorouter: 205 routed traces and 207 vias, with zero Circuit JSON error elements.
- Gerber all-layer short check: no shorts detected.
- Four copper layers, 0.15 mm minimum trace width, 0.30 mm minimum via hole, and 0.45 mm minimum via pad.
- The fabrication archive contains copper, solder mask, paste, silkscreen, outline, plated/non-plated drills, BOM, and pick-and-place data.
The autorouter reports two fixed 10 mm length advisories (12.38 mm and 11.95 mm) on oscillator-related routes. These are advisory warnings rather than shorts or clearance errors; the physical oscillator components are placed next to the target MCU. The bottom-side DNP microSD socket also produces a generic edge-orientation advisory because the checker does not account for this footprint's intended card-entry geometry.
## References
- TI MSP-EXP430FR5994 tool page: https://www.ti.com/tool/MSP-EXP430FR5994
- TI MSP430FR5994 LaunchPad user guide and seven-sheet schematic: https://www.ti.com/lit/ug/slau678c/slau678c.pdf
## Build and verify
```sh
bun install
bun run typecheck
bun run build
bunx tsci check netlist
bunx tsci check placement
bunx tsci check shorts index.circuit.tsx --mode gerber --layer all
bun run render
```