ShiboSoftwareDev/t113-s3-linux-computer-p9

The code defines a PCB subcircuit for a buck converter module featuring a TMI3112H IC, FTC252010S power switch, and associated passive components like capacitors and resistors for voltage regulation and feedback control.

Version
0.1.4
License
unset
Stars
0

stages/03-microsd-boot.circuit.tsx

PCBPCB preview for stages/03-microsd-boot.circuit.tsx
SchematicSchematic preview for stages/03-microsd-boot.circuit.tsx
import { MicroSdBootSubcircuit } from "../subcircuits/microsd-boot"

export default function MicroSdBootStage() {
  return (
    <board
      name="T113_S3_MICROSD_BOOT_STAGE"
      title="T113-S3 removable Linux boot and root filesystem"
      width="48mm"
      height="40mm"
      layers={10}
      allowBlindAndBuriedVias={false}
      isViaInPadAllowed={false}
      autorouter="default"
      autorouterVersion="beta_pipeline9"
      autorouterEffortLevel="10x"
      defaultTraceWidth="0.15mm"
      minTraceWidth="0.10mm"
      minTraceToPadEdgeClearance="0.08mm"
      minPadEdgeToPadEdgeClearance="0.08mm"
      minViaEdgeToPadEdgeClearance="0.10mm"
      minViaHoleDiameter="0.30mm"
      minViaPadDiameter="0.55mm"
      pcbStyle={{ viaHoleDiameter: "0.30mm", viaPadDiameter: "0.55mm" }}
      schAutoLayoutEnabled
    >
      <schematicsheet name="STORAGE_STAGE" displayName="Linux boot storage" sheetSize="ANSI_B">
        <schematicsection name="MICROSD_BOOT" displayName="SDC0 microSD boot and rootfs" />
      </schematicsheet>
      <MicroSdBootSubcircuit exposeToParent={false} />
      <copperpour name="MICROSD_3V3_PLANE" connectsTo="net.VDD_3V3" layer="inner2"
        clearance="0.25mm" boardEdgeMargin="0.5mm" />
      <copperpour name="MICROSD_GND_PLANE" connectsTo="net.GND" layer="inner5"
        clearance="0.25mm" boardEdgeMargin="0.5mm" />
    </board>
  )
}